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INTEGRATED CIRCUITS
DATA SHEET
74AHC139; 74AHCT139 Dual 2-to-4 line decoder/demultiplexer
Product specification File under Integrated Circuits, IC06 1999 Sep 01
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
FEATURES * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V * Balanced propagation delays * All inputs have Schmitt trigger actions * Inputs accept voltages higher than VCC * For AHC only: operates with CMOS input levels * For AHCT only: operates with TTL input levels * Specified from -40 to +85 C and -40 to +125 C. DESCRIPTION
74AHC139; 74AHCT139
The 74AHC/AHCT139 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74AHC/AHCT139 are high-speed, dual 2-to-4 line decoder/demultiplexers. This device has two independent decoders, each accepting two binary weighted inputs (nA0 and nA1) and providing four mutually exclusive active LOW outputs (nY0 to nY3). Each decoder has an active LOW enable input (nE). When nE is HIGH, every output is forced HIGH. The enable input can be used as the data input for a 1-to-4 demultiplexer application. The `139' is identical to the HEF4556 of the HE4000B family.
QUICK REFERENCE DATA Ground = 0 V; Tamb = 25 C; tr = tf 3.0 ns. TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay nAn to nYn nE to nYn CI CO CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. input capacitance output capacitance power dissipation capacitance CL = 50 pF; f = 1 MHz; notes 1 and 2 VI = VCC or GND CONDITIONS AHC CL = 15 pF; VCC = 5 V 3.9 3.4 3.0 4.0 25.76 4.7 3.6 3.0 4.0 22.36 ns ns pF pF pF AHCT UNIT
1999 Sep 01
2
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
FUNCTION TABLE See note 1. INPUTS nE H L L L L Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care. ORDERING INFORMATION OUTSIDE NORTH AMERICA 74AHC139D 74AHC139PW 74AHCT139D 74AHCT139PW PINNING PIN 1 and 15 2 and 3 4, 5, 6 and 7 8 9, 10, 11 and 12 13 and 14 16 SYMBOL 1E and 2E 1A0 and 1A1 1Y0, 1Y1, Y2 and 1Y3 GND 2Y3, 2Y2, 2Y1 and 2Y0 2A1 and 2A0 VCC address inputs outputs (active LOW) ground (0 V) outputs (active LOW) address inputs DC supply voltage DESCRIPTION enable inputs (active LOW) PACKAGES NORTH AMERICA PINS 74AHC139D 74AHC139PW DH 74AHCT139D 74AHCT139PW DH 16 16 16 16 PACKAGE SO TSSOP SO TSSOP nA0 X L H L H nA1 X L L H H nY0 H L H H H nY1 H H L H H OUTPUTS nY2 H H H L H
74AHC139; 74AHCT139
nY3 H H H H L
MATERIAL plastic plastic plastic plastic
CODE SOT109-1 SOT403-1 SOT109-1 SOT403-1
1999 Sep 01
3
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
74AHC139; 74AHCT139
handbook, halfpage
1E 1 1A0 2 1A1 3 1Y0 4 1Y1 5 1Y2 6 1Y3 7 GND 8
MNA465
16 VCC 15 2E 14 2A0
handbook, halfpage
1 1E 2 3 1Y0 1A0 1A1 1Y1 1Y2 1Y3 14 13 2Y0 2A0 2A1 2E 2Y1 2Y2 2Y3
4 5 6 7 12 11 10 9
139
13 2A1 12 2Y0 11 2Y1 10 2Y2 9 2Y3
15
MNA466
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage handbook, halfpage
1Y0 2 3 1A0 1A1 1Y1 1Y2 1Y3 1 1E
4 5 6 7
2 3 1
DX 0 0 01 G 3 1 2 3 DX 0 01 G 3 1 2 0 3
4 5 6 7 2 3 1 1 2 EN
X/Y 0 1 2 3 X/Y 0 1 2 EN 1 2 3
4 5 6 7
12 11 10 9 14 13 15
12 11 10 9
MNA467
14 13 15
2Y0 12 14 13 2A0 2A1 2Y1 11 2Y2 10 2Y3 15 2E
MNA468
9
(a)
(b)
Fig.3 IEC logic symbol.
Fig.4 Functional diagram.
1999 Sep 01
4
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
RECOMMENDED OPERATING CONDITIONS 74AHC SYMBOL VCC VI VO Tamb tr,tf (t/f) PARAMETER DC supply voltage input voltage output voltage operating ambient temperature see DC and AC characteristics per device VCC = 5 0.5 V CONDITIONS MIN. 2.0 0 0 -40 -40 - - TYP. MAX. MIN. 5.0 - - +25 +25 - - 5.5 5.5 VCC +85 100 20 4.5 0 0 -40 - -
74AHC139; 74AHCT139
74AHCT UNIT TYP. MAX. 5.0 - - +25 +25 - - 5.5 5.5 VCC +85 - 20 V V V C ns/V
+125 -40
+125 C
input rise and fall ratio VCC = 3.3 0.3 V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO package: above 70 C the value of PD derates linearly with 8 mW/K. For TSSOP package: above 60 C the value of PD derates linearly with 5.5 mW/K. PARAMETER DC supply voltage input voltage DC input diode current DC output diode current DC output source or sink current DC VCC or GND current storage temperature power dissipation per package for temperature range: -40 to +125 C; note 2 VI < -0.5 V; note 1 VO < -0.5 V or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V CONDITIONS MIN. MAX. UNIT -0.5 -0.5 - - - - -65 - +7.0 +7.0 -20 20 25 75 500 V V mA mA mA mA mW
+150 C
1999 Sep 01
5
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
DC CHARACTERISTICS Family 74AHC Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 3.0 5.5 VIL LOW-level input voltage 2.0 3.0 5.5 VOH HIGH-level output voltage; all outputs HIGH-level output voltage VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage; all outputs LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 8.0 mA II IOZ ICC CI input leakage current 3-state output OFF current quiescent supply current input capacitance VI = VCC or GND 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 5.5 MIN. 1.5 2.1 - - - 1.9 2.9 4.4 - - - - - 2.0 3.0 4.5 25 TYP. - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.36 0.36 0.1 Tamb (C) -40 to +85 - - 0.5 0.9 1.65 - - -
74AHC139; 74AHCT139
-40 to +125 UNIT - - 0.5 0.9 1.65 - - - V V V
MAX. MIN. MAX. MIN. MAX. 1.5 2.1 - - - 1.9 2.9 4.4 1.5 2.1 - - - 1.9 2.9 4.4 V
3.85 -
3.85 -
3.85 -
2.58 - 3.94 - - - - - - - - - - 0 0 0 - - - - - 3
2.48 - 3.8 - - - - - - - 0.1 0.1 0.1 0.44 0.44 1.0 2.5 40 10
2.40 - 3.70 - - - - - - - - - - 0.1 0.1 0.1 0.55 0.55 2.0
V
V
A
VI = VIH or VIL; 5.5 VO = VCC or GND VI = VCC or GND; IO = 0 5.5 -
0.25 - 4.0 10 - -
10.0 A 80 10 A pF
1999 Sep 01
6
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
Family 74AHCT Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage; all outputs HIGH-level output voltage VOL LOW-level output voltage; all outputs LOW-level output voltage II IOZ input leakage current 3-state output OFF current VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -8.0 mA VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 8.0 mA VI = VIH or VIL VCC (V) 4.5 to 5.5 4.5 to 5.5 4.5 - - 4.5 25 - 0.8 - Tamb (C) -40 to +85 - 0.8 -
74AHC139; 74AHCT139
-40 to +125 UNIT - 0.8 -
MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 - 4.4 2.0 - 4.4 2.0 - 4.4 V V V
4.5 4.5
3.94 -
- 0
- 0.1
3.8 -
- 0.1
3.70 - - 0.1
V V
4.5 5.5
- - -
- - -
0.36 0.1
- -
0.44 1.0 2.5
- - -
0.55 2.0
V A
VI = VIH or VIL; 5.5 VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0
0.25 -
10.0 A
ICC ICC
quiescent supply VI = VCC or GND; 5.5 current IO = 0 additional quiescent supply current per input pin input capacitance VI = VCC - 2.1 V; other inputs at VCC or GND; IO = 0 4.5 to 5.5
- -
- -
4.0 1.35
- -
40 1.5
- -
80 1.5
A mA
CI
-
-
3
10
-
10
-
10
pF
1999 Sep 01
7
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
AC CHARACTERISTICS Type 74AHC139 Ground = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 3.0 to 3.6 V; note 1 tPHL/tPLH propagation delay nAn to nYn propagation delay nE to nYn propagation delay nAn to nYn propagation delay nE to nYn VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay nAn to nYn propagation delay nE to nYn propagation delay nAn to nYn propagation delay nE to nYn Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. see Figs 5 and 7 see Figs 6 and 7 see Figs 5 and 7 see Figs 6 and 7 15 pF - - 50 pF - - 3.9 3.4 5.6 4.9 7.2 6.3 9.2 8.3 1.0 1.0 1.0 1.0 8.5 7.5 10.5 9.5 see Figs 5 and 7 see Figs 6 and 7 see Figs 5 and 7 see Figs 6 and 7 15 pF - - 50 pF - - 5.5 4.8 7.9 6.9 11.0 9.2 14.5 12.7 1.0 1.0 1.0 1.0 13.0 11.0 16.5 14.5 CL MIN. 25 TYP. Tamb (C) -40 to +85
74AHC139; 74AHCT139
-40 to +125 UNIT
MAX. MIN. MAX. MIN. MAX.
1.0 1.0 1.0 1.0
14.0 11.5 18.5 16.0
ns ns ns ns
1.0 1.0 1.0 1.0
9.0 8.0 11.5 10.5
ns ns ns ns
1999 Sep 01
8
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
Type 74AHCT139 Ground = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay nAn to nYn propagation delay nE to nYn propagation delay nAn to nYn propagation delay nE to nYn Note 1. Typical values at VCC = 5.0 V. see Figs 5 and 7 see Figs 6 and 7 see Figs 5 and 7 see Figs 6 and 7 15 pF - - 50 pF - - 4.7 3.6 6.5 5.2 7.2 6.3 9.2 8.3 1.0 1.0 1.0 1.0 8.5 7.5 10.5 9.5 CL 25 Tamb (C) -40 to +85
74AHC139; 74AHCT139
-40 to +125
UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
1.0 1.0 1.0 1.0
9.0 8.0 11.5 10.5
ns ns ns ns
1999 Sep 01
9
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
AC WAVEFORMS
74AHC139; 74AHCT139
handbook, halfpage
VI VM(1)
handbook, halfpage
VI VM(1)
nAn INPUT GND
nE INPUT GND t PHL t PLH VOH nYn OUTPUT
MNA469
t PHL
t PLH
VOH nYn OUTPUT VOL VM(1)
VM(1)
MNA470
VOL
FAMILY AHC AHCT Fig.5
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM INPUT 1.5 V
VM OUTPUT 50% VCC
FAMILY AHC AHCT Fig.6
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM INPUT 1.5 V
VM OUTPUT 50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
The address input (nAn) to output (nYn) propagation delays.
The enable input (nE) to output (nYn) propagation delays.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL
MNA219
VO
1000
VCC open GND
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND
S1
Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. (See Chapter "AC characteristics" for values). RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.7 Load circuitry for switching times.
1999 Sep 01
10
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm
74AHC139; 74AHCT139
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1999 Sep 01
11
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
74AHC139; 74AHCT139
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c y HE vMA
Z
16
9
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04
1999 Sep 01
12
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. Manual soldering
74AHC139; 74AHCT139
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Sep 01
13
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
74AHC139; 74AHCT139
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Sep 01
14
Philips Semiconductors
Product specification
Dual 2-to-4 line decoder/demultiplexer
NOTES
74AHC139; 74AHCT139
1999 Sep 01
15
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/01/pp16
Date of release: 1999
Sep 01
Document order number:
9397 750 06157

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